EINDHOVEN, The Netherlands, June 06, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled…
Infineon presents its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC)…
TDK Corporation (TSE 6762) announces the introduction of two new models to the 5kW TDK-Lambda GENESYS+™ series of high-power density…
Flex Power Modules will be showing their new 700 W digital quarter brick DC/DC converter at embedded world 2023 in…
MAX77659 SIMO PMIC with built-in switching charger reduces bill of materials by 60 percent Wilmington, Mass. – Sept. 21, 2021…
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency…
Flex Power Modules announces it is now a Member of the Xilinx Partner Program, giving customers easier access to both…
In power electronics and the semiconductor market the system approach is gaining momentum. To support this trend, Infineon Technologies AG…
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density CHANDLER,…
LAKE OSWEGO, Ore. — July 27, 2021 — CUI Devices’ Interconnect Group today announced the addition of modular connectors to its connectors…