System offers highest port density and speed in the smallest available package LISLE, IL – March 9, 2016 – At…
Cross-fabric optimization accelerates multi-chip integration for smaller, lighter, power-optimized wireless mobile devices Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced…
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced today four compact, low-power, highly integrated…
Sony Corporation ("Sony") is announcing the commercialization of a new Exmor RS™ image sensor for smartphones and other devices that…
Targeted toward Expanded Adoption in High-Current Load Switch Applications Such as Motor and Heater Control Circuits Renesas Electronics Corporation (TSE:…
STMicroelectronics has expanded its Intelligent Power Module portfolio with the introduction of the SLLIMM™[1] -nano 2nd series, adding higher power…
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class…
MediaTek Launches Imagiq™ Image Signal Processor, Accelerating the Smartphone Multimedia Revolution Dual camera support, high-definition images and video features offer…
Xilinx, Inc. announced it has developed a 16nm FinFET+-based programmable device running 56G transceiver technology using the 4-level Pulse Amplitude…
Panasonic Corporation will exhibit its power device products at the Applied Power Electronics Conference and Exposition 2016 (APEC 2016) over…