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Analog Devices’ Low Dropout Regulators Enable Cleaner and Faster Communications

today announced two series of low dropout regulators (LDOs) offering ultra-low noise performance that eliminate unwanted system noise and improve…

10 years ago

Highly Integrated Multiprotocol Transceiver Reduces Component Count in RS485/RS232 Systems

MILPITAS, CA - March 16, 2016 - Linear Technology Corporation introduces the LTC2873, an RS485/RS232 multiprotocol transceiver in a small…

10 years ago

Build SFP28 Modules for Data Centers and Radio Access with Industry’s First Transceiver IC in Mass Production

Keep heat away from lasers using Maxim Integrated’s transceiver chip and TO-can optics. Enables low-cost optics: Reduced module BOM through…

10 years ago

Tektronix Announces Industry’s First NBASE-T Compliance Testing Solution Automated Test Application Supports Multiple Data Rates and Standards Including NBASE-T and the Emerging IEEE 802.3bz

Tektronix, a leading worldwide provider of measurement solutions, today announced the industry's first automated compliance test solution for the NBASE-T…

10 years ago

Launch of ams’ tiny, cost-effective AS3412 opens up mass market opportunity for active noise cancellation

 New AS3412 noise cancellation speaker driver is ideal for use in the bundled head-sets supplied with smartphones ams AG (SIX:…

10 years ago

The Qt Company introduces Qt 5.6 enabling stable long-term development of advanced applications across desktop, mobile and embedded platforms

Long-Term Supported release adds cross-platform High-DPI functionality, extends to full Windows 10 support, Windows host development for embedded Linux and…

10 years ago

Enjoy good days and good nights with Philips Hue white ambiance

Frankfurt, Germany – Philips Lighting, a Royal Philips (NYSE: PHG, AEX: PHIA) company and global leader in lighting, unlocks the…

10 years ago

Molex Debuts Nano-Pitch I/O™ 80-Circuit Interconnect at DesignCon 2016 System offers highest port density and speed in the smallest available package

System offers highest port density and speed in the smallest available package LISLE, IL – March 9, 2016 – At…

10 years ago

Cadence Announces Availability of Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging

Cross-fabric optimization accelerates multi-chip integration for smaller, lighter, power-optimized wireless mobile devices Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced…

10 years ago

Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market

Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, announced today four compact, low-power, highly integrated…

10 years ago