September 26, 2023 – XP Power announces the release of a family of single output, PCB mounting AC-DC power modules…
Munich, Germany – 22 September, 2023 – In many sectors, conventional keys are fast becoming obsolete, a development that has…
CGD first to include individual GaN chip 2D barcodes that can be read by a commercial code reader, enabling IC…
Using Microchip’s memBrain™ nonvolatile in-memory compute technology and working with universities, IHWK is creating a SoC processor for neurotechnology devices…
The u-blox NEO-F10N is based on the u-blox F10 platform, equipped with L1/L5 dual-band technology and effective multipath mitigation. Thalwil,…
The new family of LAN8650/1 MAC-PHY devices connects low-cost microcontrollers without a built-in Ethernet MAC to a 10BASE-T1S Ethernet network…
New offering saves time, lowers shipping costs and decreases carbon footprint THIEF RIVER FALLS, Minnesota, USA - DigiKey, a leading…
Provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV…
Proven shock and vibration resistant for harsh environments congatec — a leading vendor of embedded and edge computing technology, announced…
TDK Corporation (TSE 6762) announces the introduction of 15kW and 22.5kW scalable power systems to the TDK-Lambda GENESYS+™ series of…