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Samsung Showcases Industry-leading Flash Technologies to Address Growing Requirements of Storage Systems

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a blueprint for next-generation flash memory solutions…

10 years ago

Tektronix Brings New HDR and WCG Support to Industry Leading Waveform Monitors

Tektronix, an industry-leading innovator of video test and monitoring solutions, today announced a field-installable software upgrade for its popular WFM/WVR…

10 years ago

Micron Introduces Mobile 3D NAND Solution for Next-Generation Smartphones

New Micron Mobile 32GB 3D NAND memory technology delivers better quality, performance and reliability for next-generation mobile multimedia and streaming…

10 years ago

Orange Tree announces SuperSpeed USB 3.0 FPGA module ZestSC3 provides 360Mbytes/sec sustained data transfer

Orange Tree Technologies today announced the ZestSC3, an easy to use FPGA module with a Xilinx Artix-7 user-programmable FPGA and…

10 years ago

D/A Converter Offers More Accuracy in a Smaller Footprint for Diverse Applications Ranging from Radar to Smartphone Testing

Analog Devices, Inc. (ADI) today introduced the AD9164 D/A converter that brings high resolution radar images for designers of military…

10 years ago

Silicon Labs Launches Industry’s First High-Speed Multi-Channel PLC Input Isolators

Silicon Labs (NASDAQ: SLAB) has introduced the industry’s first high-speed, multi-channel digital isolators designed to meet the demands of programmable…

10 years ago

Highly integrated Hall sensors by Infineon reduce systems costs considerably

Munich, Germany – August 4, 2016 – The new Hall sensors of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)…

10 years ago

STMicroelectronics Introduces New Super-Junction MOSFETs including World’s First 1500V Device in TO-220FP Wide Creepage Package

STMicroelectronics has introduced a portfolio of TO-220 FullPAK (TO-220FP) wide creepage power transistors, including the world’s first 1500V super-junction MOSFET…

10 years ago

NI Announces World’s First Application Framework for Massive MIMO to Speed Innovation in 5G Prototyping

AUSTIN, Texas – Aug 3, 2016 – NI (Nasdaq: NATI), the provider of platform-based systems that enable engineers and scientists…

10 years ago

STMicroelectronics Reveals Ultra-Tiny Low-Dropout Regulator in Breakthrough Bumpless Chip-Scale Package

STMicroelectronics has introduced the LDBL20, a 200mA Low-Dropout (LDO) regulator in a minuscule 0.47mm x 0.47mm x 0.2mm chip-scale package…

10 years ago