NEW PRODUCTS

ON Semiconductor Introduces World’s First Highly Scalable Family of Next-Generation Automotive Image Sensors

PHOENIX, Ariz. – Oct. 25, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations and the market leader in…

8 years ago

STMicroelectronics Announces Class-Leading Water-Resistant Pressure Sensor and First Design Win in High-Performance Wearables from Samsung

  Advanced water-resistant 10bar pressure sensor achieves best-in-class accuracy and stability for new, go-anywhere smart wearables Major design win in…

8 years ago

NI Announces New PXI FlexRIO Architecture With Xilinx Kintex UltraScale Technology

The new PXI FlexRIO Digitizers and PXI FlexRIO Coprocessor Modules drive custom hardware solutions without the need for custom design…

8 years ago

New dual-band Wi-Fi radio module with Bluetooth functionality from Panasonic enables high data rates and low-power operation

PAN9026 ideal for highly integrated and cost-effective applications Panasonic Industry Europe is announcing a dual-band 2.4/5 GHz 802.11 a/b/g/n Wi-Fi…

8 years ago

OMC launches new small-footprint SMA Tx/Rx housings

Smallest footprint; up to 25% space-saving; all-metal package; secure connection to PCB OMC, the pioneer in optoelectronics manufacturing, has launched…

8 years ago

STMicroelectronics Launches Open Development Platform for Secure Car-Connectivity Applications

The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping advanced Smart Driving applications, including vehicle connectivity to…

8 years ago

Samsung Addresses IoT Data Security at the Chip Level with New Hardware/Software Turn-Key Solution

Samsung’s Secure Element solution features eFlash memory and new dedicated security software Samsung Electronics, a world leader in advanced semiconductor…

8 years ago

STMicroelectronics’ Advanced Automotive Processors with Built-In Security Set to Protect Connected Cars against Cyber Threats

New processors combine ST’s automotive and security expertise to meet demanding safety, reliability, and quality standards Market’s first implementation of…

8 years ago

Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New Automotive MCU Solution

Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New Automotive MCU Solution Cypress Semiconductor Corp.…

8 years ago

Toshiba Electronic Devices & Storage Corporation Adds Second-Generation 650V SiC Schottky Barrier Diodes in DPAK Surface-Mount Type Package

Toshiba Electronic Devices & Storage Corporation (TDSC) has enhanced its diode portfolio with the addition of six Schottky barrier diodes…

8 years ago