November 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces the launch of its…
What’s New: Intel today announced two new members of its Intel® Xeon® processor portfolio: Cascade Lake advanced performance (expected to be…
Analog Devices, Inc. today announced a transceiver series that enables high-definition (HD) video over existing Unshielded Twisted Pair cables and unshielded…
u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the ZED-F9T high accuracy timing module.…
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is enabling more efficient inspection of smartphone displays with the introduction of…
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces the expansion of its Snappy…
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new 0.8-micrometer (μm) pixel image sensors – the…
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has extended the capabilities of its RSL10 family of Bluetooth 5 certified…
Toshiba Electronics Europe (“Toshiba”) has announced a new Bluetooth® IC for automotive applications will be added to their IC line-up.…
In Jakarta, Rohde & Schwarz will present itself as a single-source supplier of integrated solutions for secure communications and radio intelligence. Interoperable,…