Setting new benchmarks in power delivery while dealing with both uncompromising operational environments & acute space constraints In keeping with…
LynxOS-178 FAA approved Reusable Software Component ported to Teledyne e2v’s DO-254 ready Qormino® QT1040-4GB Common Computer Platform San Jose, California,…
The one- to four-position 9176-800 Series low-profile IDCs now accommodate 22–28AWG to deliver high-reliability performance in an expanded range of…
PLDA, the industry leader in PCI Express® controller IP solutions and Samtec, a privately held $800MM global manufacturer of a…
Toshiba Electronics Europe (“Toshiba”) today announced the launch of an addition to its line-up of dual H-bridge driver ICs for…
Rohde & Schwarz has signed a procurement and maintenance contract with the Defense Acquisition and Logistics Organization (DALO) of the Danish…
u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the results of its collaboration with…
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage…
During the second day of the annual Snapdragon Technology Summit, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ:QCOM), unveiled…
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the industry’s first USB-C™…