Toshiba Memory Europe GmbH today announced a range of four new JEDEC e-MMC (Embedded MultiMediaCard) Ver. 5.1 compliant embedded flash…
Dialog Semiconductor plc (XETRA:DLG), a provider of custom and configurable power management, AC/DC power conversion, charging and Bluetooth® low energy…
TDK Corporation (TSE 6762) expands its Micronas embedded motor controller portfolio with the HVC 4420F, featuring extended flash memory for…
Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today introduced a USB-C Power Delivery (PD) solution designed to reduce…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at…
Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB…
Anritsu today announced it will jointly demonstrate its MT8000A 5G tester with TCL Communication’s first 5G USB device at Mobile…
Toshiba Electronics Europe GmbH (TEE) today announced development of an image recognition SoC (System on Chip) for automotive applications that…
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in…
Microchip announces the new PolarFire™ FPGA imaging and video solution to address the challenges of developing complex computer algorithms which…