Samsung Electronics and Harman International Industries, Incorporated today announced that they have entered into a definitive agreement under which Samsung…
IC Market Drivers 2017 analyzes end-use applications and their impact on IC market growth. IC Insights will release the 2017…
IBM (NYSE: IBM) today unveiled the experimental release of Project Intu, a new, system-agnostic platform designed to enable embodied cognition. The…
Xilinx, Inc. (NASDAQ:XLNX) today unveiled details for new 16nm Virtex® UltraScale+™ FPGAs with HBM and CCIX technology. Containing the highest…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and RFbeam Microwave GmbH introduce a single Tx/Rx module which is among…
MicroVision, Inc. (NASDAQ: MVIS) , a leader in innovative ultra-miniature projection display and sensing technology and STMicroelectronics, (NYSE: STM), a global semiconductor leader…
Siemens and Bentley Systems announced today that they have formalized a strategic alliance agreement to drive new business value by…
Tinier than the AIDS virus – that is currently the circumference of the smallest transistors. The industry has shrunk the…
Agreement includes access to an expanding range of popular boards and Raspberry Pi and Arduino accessories OXFORD, UK, 10 November,…
Munich, Germany – November 9, 2016 – The Rubik’s Cube was solved in just 637 thousandths of a second: At…