BioMensio Ltd, announces today a €2.5 million funding round from private investors, VTT Ventures, Siemens Technology Accelerator and Tekes, the Finnish Funding Agency for Innovation.
BioMensio Ltd, announces today a €2.5 million funding round from private investors, VTT Ventures, Siemens Technology Accelerator and Tekes, the Finnish Funding Agency for Innovation. In addition to the capital injection, the investor consortium provides BioMensio with access to extensive knowledge and an industry network.
“BioMensio is now set to develop a smart handheld bio-screening sensor and associated cloud services to determine the presence of specific biomolecules. Rapid and accurate on-site testing enables fast and targeted action in the presence of multiple unwanted substances from a biological liquid based sample. The BioMensio biosensors allow cost efficient application development for businesses and governmental organizations in food and beverage, healthcare, security and defense segments as well as environmental monitoring area”, comments Ilari Antila, CEO.
Universality and simplicity are the main advantages of BioMensio label-free technologies. No labelling or analyte modifications are necessary unlike with traditional techniques. This makes the BioMensio sensor inherently universal and applicable to any analyte, or even DNA, on the lab-on-a-chip platform.
Joni Leinvuo, CTO BioMensio: “BioMensio devices will be powered by cost effective, well-scaling Mass- Sensitive Micro-Array (MSMA) technology. The sensing platform consists of microfluidics and an array of microscopic weighing scale pixels. Mass sensitive transducer chips are based on patented BioMensio Film-Bulk Acoustic Resonance (FBAR) technology combined with Application Specific Integrated Circuits (ASIC) – two technologies largely applied in high volume mobile device industries.”
Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…
Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…
The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…
The first unmanned ground systems left the production line only 12 weeks after the two…
The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…
The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…