LATEST NEWS

Protect IP and deploy secured connected systems with Microchip’s new CryptoAuthentication™ device and Security Design Partner Programme

ATECC608A secure element and new Security Design Partner Programme provide the parts and partners needed for designing secure solutions Programme…

9 years ago

Intel Introduces Portfolio of Commercial 5G New Radio Modems, Extends LTE Roadmap with Intel XMM 7660 Modem

Intel today announced substantial advances in its wireless product roadmap to accelerate the adoption of 5G. Highlights include the introduction…

9 years ago

A new way to store thermal energy

MIT researchers create material for a chemical heat “battery” that could release its energy on demand. In large parts of…

9 years ago

Analog Devices’ Integrated Precision Solution Enables Safer and Up to 50% More Efficient Battery Manufacturing

Analog Devices, Inc. today introduced a precision integrated analog front end, controller, and pulse-width modulator (PWM) for battery testing and formation…

9 years ago

ON Semiconductor Receives Lifestyle Category Award in Super Manufacturing Parts Grand Prize 2017

Li-ion Battery Fuel Gauge LC709203 Developed by Japanese-Based Design Team are Recognized as Parts that Contribute to the Improvement of…

9 years ago

Elastic polymer with piezo-effect A rubber power plant

Researchers from Empa have developed a flexible material that generates electricity when stressed. In future, it might be used as…

9 years ago

LG AND IDT PARTNER ON WORLD’S FIRST Qi EXTENDED POWER PROFILE SMARTPHONE

With More Than 8W of Power, LG’s Latest V30 Delivers the Fastest Wireless Charging Experience in a Smartphone LG Electronics…

9 years ago

Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC

Cypress Memory Products are the Industry’s First to Pass Stringent Qualification Process  Cypress Semiconductor Corp. (CY), the market leader in…

9 years ago

The world’s largest BiOPV installation completed in France using Heliatek’s Solar Film Solution, HeliaSol®

In a joint project with partner and investor ENGIE, the largest OPV project to date has been completed on a…

9 years ago

TI DLP® technology enables next-generation augmented reality head-up displays

New automotive-qualified DLP3030-Q1 chipset and EVMs allow automakers and Tier-1 suppliers to create HUD systems with crisp, high-quality imagery   Texas…

9 years ago