New automotive-qualified DLP3030-Q1 chipset and EVMs allow automakers and Tier-1 suppliers to create HUD systems with crisp, high-quality imagery
Texas Instruments (TI) (NASDAQ: TXN) today unveiled the next evolution of DLP® technology for in-vehicle head-up display (HUD) systems. The new DLP3030-Q1 chipset, along with supporting evaluation modules (EVMs), gives automakers and Tier-1 suppliers the ability to bring bright, dynamic augmented reality (AR) displays to windshields and place critical information within the driver’s line of sight.
Designers can take advantage of the automotive-qualified DLP3030-Q1 chipset to develop AR HUD systems that project virtual image distances (VIDs) of 7.5 meters and greater. This is made possible by the unique architecture of DLP technology that enables HUD systems to withstand the intense solar loads created when projecting long VIDs. The combination of increased VIDs and ability to showcase imagery across a wide field of view (FOV) gives designers the flexibility to create AR HUD systems with enhanced picture depth for an interactive, not distractive infotainment and cluster system. For more information about the DLP3030-Q1 chipset, see www.ti.com/DLP3030Q1-pr-eu.
Key features and benefits of the DLP3030-Q1 chipset
Tools and support
Automakers and Tier-1 suppliers can easily evaluate, design and productize HUD systems regardless of where they are in the design cycle with one of three new EVMs featuring the DLP3030-Q1 chipset.
Package, pricing and availability
The DLP3030-Q1 chipset, offered in a 32-mm by 22-mm CPGA package, is now available for sampling upon request. The EVMs are available for purchase on TI.com and are priced as follows: DLP3030-Q1 Electronics EVM (DLP3030Q1EVM) US$1,999; DLP3030-Q1 PGU EVM (DLP3030PGUQ1EVM) US$6,500; DLP3030-Q1 Combiner HUD EVM (DLP3030CHUDQ1EVM) US$25,000. Technical documentation is available upon request.
Learn more about DLP technology for automotive displays
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