APG, the premier Israeli UAS designer and manufacturer, has unveiled the Peres, the distinctively innovative family of UASs, delivering significant…
NXP Semiconductors N.V. (NASDAQ:NXPI), a leader in secure connectivity solutions and inventor of MIFARE, the leading contactless payment and access…
Flex Power Modules today announced a new one-sixteenth-brick 12V-output DC/DC converter module that can deliver 200 watts of power and…
CPI part of the UK’s High Value Manufacturing Catapult has opened its new, state-of-the-art National Formulation Centre. Formulation involves the…
Stuttgart/Bangkok – With a strategic decision Mercedes-Benz Cars is enhancing the manufacturing footprint in South-East Asia addressing growing demand for…
LEUVEN, March 14, 2018 – Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, today presented its…
VTT Technical Research Centre of Finland and the Japanese company Hitachi High-Technologies Corporation have signed a Memorandum of Understanding to…
A new method of creating bendable silicon chips could help pave the way for a new generation of high-performance flexible…
Increased expectations for the DRAM and NAND flash markets spur upward revision. IC Insights’ latest market, unit, and average selling…
Iridium Communications Inc. (NASDAQ:IRDM) today announced the next wave of Iridium Certus service providers selected to deliver this next-generation satellite…