The Series C values Lyte at $1.6 billion as the company moves its multimodal LyteVision platform into production deployments across…
The smartwatch combines a low-power NFC payment chip with a tokenized wallet supporting Mastercard and Visa services, marking the first…
First wafers are scheduled to ship in September, moving the companies’ manufacturing agreement from development towards sampling—but qualification and volume-production…
The Norwegian company’s SBM140B combines a claimed 84 dBA signal-to-noise ratio with a 146 dB SPL overload point and 24-bit…
The cybersecurity company acquired Cloud Copilot and is using its technology to launch Amphi, a free, open-source toolkit designed to…
New Echo research shows that the vulnerabilities attackers actually exploit are rarely the ones AI just found; they're the ones…
Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers to enable the industrial production of…
Companies Expand Collaboration Across Multigenerational Cloud AI Factories, Local AI Computing and Automotive MediaTek to Adopt New NVIDIA NVLink Fusion…
SK hynix has highlighted a new technology roadmap for co-packaged optics (CPO) published in Nature Electronics, outlining how optical interconnects…
AMD has announced plans to add native UCIe 1.1 connectivity to select Versal adaptive SoCs, enabling direct, high-bandwidth communication between…