Texas Instruments (TI) recently entered into an agreement with Silicon Catalyst, a Silicon Valley-based incubator, that will expand TI’s access…
Class-leading low voltage drive contributes to greater energy efficiency and performance in compact battery-driven industrial equipment Willich-Münchheide, August 25, 2016…
Industry leaders have come to an agreement to produce the “Central Sensing Localization and Planning” (CSLP) platform to accelerate the…
VTT Technical Research Centre of Finland sees positive opportunities for the growth of the electronics industry in Finland and is…
MAX32550 integrates all essential functions for secure mobile payment and pin pads San Jose, CA and Hsinchu, Taiwan — August…
New NI ELVIS RIO Control Module adds FPGA RIO technology for enhanced hands-on learning AUSTIN, Texas – August 23, 2016…
OMRON Corp. of Kyoto City will introduce to the world on Aug. 26, 2016, the HVC-P2 B5T-007001 Series, a built-in…
Targets rising demand for 3D gesture recognition and gesture control solutions in the consumer, security, automotive and industrial sensors growing…
CAMBRIDGE, United Kingdom, and SAN MATEO, CA, 23rd August 2016 UltraSoC and Movidius today announced a licensing agreement under which…