Munich, Germany – November 22, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX) adds two power boards to the…
Surface-Mount Devices Feature eSMP® SMPC (TO-277A) Package With Low 1.1 mm Profile MALVERN, Pa. — Nov. 21, 2016 — Vishay…
MILPITAS, CA - November 21, 2016 - Linear Technology Corporation announces the LT8630, a 600mA, 100V input capable synchronous step-down…
MAX32560 integrates security features and payment interfaces to meet latest PCI-PTS standards and reduce development time MUNICH, Germany, and CANNES,…
COSMICC, Horizon 2020 Project, Combines CMOS Electronics and Silicon Photonics With Innovative High-throughput, Fiber-attachment Techniques To Reach beyond 1 Tb/s…
THIEF RIVER FALLS, Minnesota, USA – Fourteen lucky students attending Student Day at electronica in Munich won prizes sponsored by…
CUI Inc today announced a family of ultra‑compact ac-dc power supplies in an open frame SIP package. The 3 W…
Panasonic Avionics selects Ericsson for 5G-ready core across multiple markets Panasonic Avionics Corporation will provide LTE technology to the air…
Renishaw is collaborating with Dassault Systèmes, a world leading 3D modelling, simulation and industrial operations software provider, as part of…
adidas has today unveiled the world’s first performance shoe made using Biosteel® fiber – a replication of natural silk –…