NEW PRODUCTS

Vishay Intertechnology Bidirectional 1500 W PAR® TVS Offer High Power Density to Save Board Space and Lower Costs

Surface-Mount Devices Feature eSMP® SMPC (TO-277A) Package With Low 1.1 mm Profile

MALVERN, Pa. — Nov. 21, 2016 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the industry’s first bidirectional 1500 W surface-mount PAR® transient voltage suppressors (TVS) in the low-profile eSMP® SMPC (TO-277A) package. With their low height of 1.1 mm typical, devices in the TPCxxCA series offer a 52 % lower profile than TVS in the traditional SMC package while providing a 38 % smaller footprint to reduce total volume by 70 %. For designers, this high power density saves board space for lower system costs.

For high temperature stability in high-reliability conditions, the Vishay General Semiconductor TVS released today feature a patented PAR construction for a temperature range of -65 °C to +185 °C. The TPCxxCA series offers breakdown voltages from 11 V to 36 V, excellent clamping capability from 15.6 V to 49.9 V, low leakage current, and very fast response times.

The TVS components are designed to protect sensitive electronics against electrostatic discharge (ESD) and voltage transients induced by inductive load switching and lightning. Typical applications will include automotive, telecommunications, consumer electronics, and industrial equipment. Ideal for automated placement, the TVS meet MSL level 1 standards per J-STD-020 and are RoHS-compliant and halogen-free. The devices are available in AEC-Q101-qualified versions.

Samples and production quantities of the new TPCxxCA series are available now, with lead times of eight weeks for large orders. Pricing for U.S. delivery starts at $0.35 per

Liat

Recent Posts

60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications

XP Power introduces the AMF60 series of 60W wall-mount AC-DC power supplies for medical, home…

5 days ago

ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables

ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 -…

5 days ago

Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems

Platform Root of Trust and secure boot controllers help system architects prepare for emerging mandates…

5 days ago

AU10TIX Advances Privacy-First Approach to Age Assurance as Regulatory Pressure Increases

AU10TIX, a global leader in identity verification and fraud prevention, is further advancing its privacy-first approach to age…

5 days ago

New Samtec SMA Interconnects Capable of 26.5 GHz

Samtec, Inc. announces availability of 26.5 GHz SMA interconnects supporting test & measurement, military, aerospace…

5 days ago

Tower Semiconductor and Axiro Semiconductor Deliver High-Power, High-Efficiency SiGe ICs for Secure U.S. Defense Applications

Leveraging Tower's advanced SiGe technology, these U.S.-fabricated Beamforming ICs achieve superior performance, and strengthen secure…

7 days ago