CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

9 years ago

CEVA-XC12 is the industry's first DSP capable of meeting the extreme performance requirements critical to the success of 5G, gigabit…

ON Semiconductor Sampling Industry’s Lowest Power Bluetooth® Low Energy SoC for IoT and Connected Health & Wellness

9 years ago

Highly flexible Bluetooth 5 certified Radio System-on-Chip (SoC) provides faster data rates & greater functionality while maximizing system battery life…

Integrated MOSFET voltage regulator for high-density applications reduces component count

9 years ago

Munich, Germany – February 23, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the IR3883, an easy-to-use,…

UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps Data Rates

9 years ago

TowerJazz, the global specialty foundry leader, and The University of California, San Diego (UCSD), a recognized leader for microwave, millimeter-wave,…

Vicor introduces the first in a new family of 20 Amp 48V Cool-Power ZVS Buck Regulators

9 years ago

The PI3525-00-LGIZ is the latest addition to the Cool-Power ZVS Buck Regulator Portfolio with a 48V (30-60Vin) input. The PI352x…

New research shows perception of STEM subjects is improving

9 years ago

Combined efforts by teachers, industry, engineering organisations and the Government to change the perception of science, technology, engineering and maths…

NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment

9 years ago

the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, today announced the…

3Q: Julien de Wit on the discovery of seven temperate, nearby worlds

9 years ago

Today, an international team including astronomers from MIT and the University of Liège in Belgium has announced the discovery of…

DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development

9 years ago

BRISTOL, UK and EINDHOVEN, Netherlands, Feb. 23, 2017 – DuPont Electronics & Communications (DuPont) and Holst Centre today announced the…

Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

9 years ago

IC Insights recently released its new Global Wafer Capacity 2017-2021 report that provides in-depth detail, analyses, and forecasts for IC…