Airbus signs strategic partnership with ONERA and DLR

9 years ago

Leading researchers target next generation Computational Fluid Dynamics Airbus has signed a partnership with two leading European Research facilities, ONERA…

Cellphone IC Sales Will Top Total Personal Computing in 2017

9 years ago

Higher memory prices accelerate sales growth in both cellphones and personal computing systems but cellular handsets will become the largest…

Infineon receives “Supplier of the Year Award” from DENSO

9 years ago

Munich, Germany – 19 June 2017 – The Japanese automotive system supplier DENSO has honored Infineon with a “Supplier of…

How Wearable Health Technology is Changing the Face of Healthcare

9 years ago

The miniaturization of biomedical sensors, the proliferation of smartphones and the rise of power efficient wireless protocols has started a…

INTERCONNECT DESIGN CONSIDERATIONS FOR INDUSTRIAL APPLICATIONS

9 years ago

Designers in the telecommunications, high-performance computing, and medical industries face ever-changing electrical and mechanical interconnect requirements.  These industries are driven…

France aims to have ‘driverless’ high-speed TGV trains by 2023

9 years ago

SNCF will begin testing ‘drone train’ in 2019, though conductors will still be onboard to handle emergencies France’s national railway…

Samsung Achieves 220 Lumens per Watt with New Mid-Power LED Package

9 years ago

Samsung Electronics, a world leader in advanced component solutions, today announced that it has begun mass producing a new mid-power…

GE Renewable Energy and Fina Enerji Sign Ten-year Full Service Agreement in Turkey

9 years ago

Continuing its pioneering collaboration in the development of clean energy in Turkey, GE Renewable Energy and Fina Enerji have concluded…

7 of the Top 10 Smartphone Suppliers Headquartered in China

9 years ago

China accounted for 10 of top 14 leading smartphone suppliers in 2016, share grows to 39%. IC Insights recently released…

Melexis announces availability of highly integrated Time-of-Flight 3D vision solution

9 years ago

Melexis today announces a new Time-of-Flight (ToF) chipsetand development kit that enables simple, modular and future proof design of 3D vision…