LATEST NEWS

Melexis announces availability of highly integrated Time-of-Flight 3D vision solution

Melexis today announces a new Time-of-Flight (ToF) chipsetand development kit that enables simple, modular and future proof design of 3D vision solutions. Previously available only as part of a development system, the chipset is now available to designers everywhere.

The newly available chipset includes the MLX75023 1/3-inch optical format ToF sensor and the MLX75123 companion IC that embeds many of the external components normally required to develop a 3D vision solution. With this high level of integration, designers no longer have to be concerned with expensive (and space-hungry) external FPGAs and ADCs thereby reducing size, design cost, product cost and time-to-market.

The MLX75023 ToF sensor offers the world’s smallest pixel at QVGA resolution with 63 dB linear dynamic range and sunlight robustness, thanks to Melexis’ advanced pixel technology. The MLX75123 companion chip directly interfaces the sensor IC to a host MCU and provides rapid readout of data from the sensor.

The modular approach taken in designing the chipset means that the sensor can be changed / upgraded without having to change the product architecture. This allows the design of multiple solutions with the same base design as well as rapid implementation of new sensors as they reach the market.

Typical applications for the chipset include gesture recognition, driver monitoring and occupant detection in automotive applications. The chipset is ideal for other applications including Industrial (conveyer belts, robotics, volume measurement) and Smart Cities (people counting, security, etc.). The chipset is available in both automotive (-40°C to +105°C) and industrial (-20°C to +85°C) grades.

Gaetan Koers, Product Manager for Melexis commented: “We are very excited about the possibilities the launch of this chipset unleashes. The simplicity that it brings to the design process will ensure that more applications will be able to benefit from 3D TOF vision. In this fast-moving technology sector the in-built future proofing will mean that our customers will be able to remain at the leading edge for years to come.”

 

Lihi

Recent Posts

Yaron Elad and Elik Etzion Launch AlphaDrive, a $100 Million Fund Focusing on Cyber and AI Investments

Leumi Partners has joined the fund as an anchor investor. The fund has already invested…

46 minutes ago

60W DOE Level VII ready IP42-sealed wall-mount adapters for medical, home healthcare, and industrial applications

XP Power introduces the AMF60 series of 60W wall-mount AC-DC power supplies for medical, home…

6 days ago

ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables

ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 -…

6 days ago

Microchip Expands its Family of Post-Quantum Ready Root of Trust Controllers for Next Generation Systems

Platform Root of Trust and secure boot controllers help system architects prepare for emerging mandates…

6 days ago

AU10TIX Advances Privacy-First Approach to Age Assurance as Regulatory Pressure Increases

AU10TIX, a global leader in identity verification and fraud prevention, is further advancing its privacy-first approach to age…

6 days ago

New Samtec SMA Interconnects Capable of 26.5 GHz

Samtec, Inc. announces availability of 26.5 GHz SMA interconnects supporting test & measurement, military, aerospace…

6 days ago