Belden Introduces New Products to Enhance Productivity at SPS/IPC/Drives 2017

9 years ago

Belden Inc., a global leader in signal transmission solutions for mission-critical applications, will demonstrate at SPS/IPC/Drives 2017 in Nuremberg how…

BAE Systems awards multimillion euro contract to Konstrukta-Defence,a.s in Slovak Republic

9 years ago

AE Systems has contracted with Konstrukta-Defence,a.s, a leading defence company in the Slovak Republic that operates as an artillery system…

Toshiba Electronic Devices & Storage Corporation to Unveil Low Voltage 5GHz Receiver for Next-Generation Wireless LAN

9 years ago

Toshiba Electronic Devices & Storage Corporation (TDSC) today announced development of a low voltage 5GHz receiver for the next-generation IEEE802.11ax[1] wireless…

Renesas Electronics and Cogent Embedded Collaborate to Make 3D Surround View Parking Assist System Standard in All New Cars

9 years ago

New Solution Combining Customizable 3D Surround View Software and R-Car V3M Realizes Parking Assist System Without Using GPU Renesas Electronics…

DNA Finland chooses Ericsson for metadata

9 years ago

Ericsson will provide editorial services and rich metadata for over 150 TV channels in Finnish, English and Swedish Ericsson’s rich…

Mini-IO adopted as an International Electrotechnical Commission standard

9 years ago

IEC 61076-3-122 provides miniaturized connector standard for industrial applications in harsh environments TE Connectivity (TE), a world leader in connectivity…

Unique DC/DC converter combines true fixed frequency and ultra-fast transient response with integrated compensation

9 years ago

TI’s stackable 16-V input, 40-A SWIFT™ DC/DC buck converter features innovative control topology Texas Instruments (TI) (NASDAQ: TXN) today introduced…

SJSemi and Qualcomm Jointly Announce Qualification of 10nm Ultra-high Density Wafer Bumping Technology

9 years ago

SJ Semiconductor Corp. (SJSemi) and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced that SJSemi has started the…

600 V Super-Junction Power Modules from STMicroelectronics Add New Package Options and Features to Simplify Motor Drives

9 years ago

New SLLIMM™-nano intelligent power modules (IPM) from STMicroelectronics introduce extra package options and integrate additional components to accelerate development and simplify…

Finnish technology will plunge into Saturn’s atmosphere onboard Cassini

9 years ago

The mission of NASA's Cassini will end when the probe is directed into Saturn's atmosphere at around 3 pm Finnish time…