In the future, will people have virtual twins to help monitor their health? That is what Health EU is proposing.…
Teledyne e2v has revealed the QLS1046-4GB, an ultra-compact computing module combining the NXP LS1046 Arm® based processor with 4GB DDR4…
GE Healthcare’s most advanced radiology ultrasound system – the LOGIQ™ E10 – offers 48X data throughput and 10X processing power…
Company’s eSIM family includes the SN100U, the world’s most integrated “all-in-one” chipset featuring NFC, Secure Element, and eSIM and the…
50 V silicon carbide Schottky diodes feature superior switching performance and higher reliability APEC 2018 – Booth #601 – SAN…
Intel today unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial…
Ericsson President and CEO Börje Ekholm declared 5G open for business during a briefing to media and analysts on Monday,…
- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices,…
S3 Semiconductors, announced today the introduction of its SmartEdge™ Platform, giving its customers access to cost-optimized, custom single-chip solutions that…
Erlangen and Munich, 27 February 2018 – New features in the car require electronic control units that are networked, with…