The BMBF-funded OWICELLS project was successfully completed with a final presentation at the BMW plant in Munich. The presentation demonstrated…
Munich, Germany and Villach, Austria 14 June 2018 – The European research project iDev40 (Integrated Development 4.0) is launched today…
(IMS 2018) – Semiconductors N.V. (NASDAQ:NXPI) is driving innovation with its expanded cellular infrastructure portfolio of GaN and silicon laterally diffused…
Ericsson (NASDAQ: ERIC) and Intel, together with China Mobile Research Institute and China Mobile Jiangsu Company, have successfully demonstrated the…
High-reliability connector supplier Harwin has announced further additions to its Sycamore Contact product offering. While this series was initially capable…
IC Insights recently released its Update to its 2018 IC Market Drivers Report. The Update includes IC Insights’ latest outlooks on the smartphone, automotive, PC/tablet…
TDK Corporation (TSE:6762) is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for…
Audi is taking the idea of electric mobility beyond the automobile in offering its customers a tailormade system offering. To…
Intel researchers are taking new steps toward quantum computers by testing a tiny new “spin qubit” chip. The new chip…
Rohde & Schwarz introduces the new high-performance R&S RTP family, expanding its oscilloscope portfolio in keeping with its motto "Oscilloscope Innovation. Measurement Confidence."…