The launch of Parker Solar Probe, the mission that will get closer to the Sun than any human-made object has…
Toshiba Electronics Europe (“Toshiba”) announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive…
MediaTek Incorporated and Anritsu Corporation agreed to forge a partnership for 5G development and physical layer verification. MediaTek Inc. selected…
Wurth Electronics Midcom is proud to announce the release of additional Current Sense transformers to the MID-SNS family. “These surface…
Premier Farnell, the Development Distributor, has signed a contract with SSI Schaefer, one of the global market leaders and innovators…
High-reliability connector supplier Harwin has announced further additions to its Sycamore Contact product offering. While this series was initially capable…
NXP Semiconductors N.V.(NASDAQ:NXPI), has announced the next phase in its Smart City collaboration with Columbus, Ohio, the winner of the…
Baidu announced that it plans to work with Mobileye to integrate and commercially deploy Mobileye’s Responsibility Sensitive Safety (RSS) model in both…
Leti, a research institute of CEA Tech, today announced that field trials of its new Low Power Wide Area (LPWA)…
Thorigné-Fouillard and Montaigu, France – June 29, 2018, 8:00am. CET – Kerlink (ALKLK - FR0013156007), a specialist and global leader in solutions dedicated to…