Best-in-class ARM processor in application friendly shape

8 years ago

congatec announces the conga-SMX8, the company's first SMARC 2.0 Computer-on-Module based on the 64-bit NXP i.MX8 multi-core ARM processor family.…

Intel to Collaborate with SiTime on MEMS Timing for 5G Modems

8 years ago

What’s New: Intel and SiTime Corporation*, a provider of MEMS timing solutions, have announced that they will work together on robust,…

Play selects Ericsson to accelerate nationwide mobile network expansion in Poland

8 years ago

The expansion of Play’s network includes radio access network components as well as Operation Support System (OSS) components with Ericsson…

Toshiba launch high current photorelays in DIP4 package

8 years ago

Toshiba Electronics Europe (“Toshiba”) has launched two new high current photorelays that are fabricated using the latest U-MOS IX semiconductor…

Compact Power Entry Module with Filter

8 years ago

The DD12 filter series combines an IEC C14 appliance plug with a 1- or 2-pole fuse holder, a 1- or…

The winning team tracks the secure transport of blood samples with a Würth Elektronik radio module

8 years ago

Würth Elektronik eiSos GmbH & Co. KG supported the winning team in the start-up competition "DX-Labtrack" at the Hackathon TECHFEST…

Samsung Begins Mass Producing Industry’s First 2nd-Generation 10nm-Class, 16Gb LPDDR4X Mobile DRAM

8 years ago

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first…

Analog Devices and B-Secur Collaborate on Biometric Authentication Technologies for the Automotive Industry

8 years ago

Analog Devices, Inc. (ADI) announced today a collaboration with B-Secur LTD to develop a complete biometric authentication solution for use…

C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC

8 years ago

UltraSoC today announced that C-SKY Microsystems Co Ltd (“C-SKY”), a China-based semiconductor company acquired by the Alibaba Group in April, has licensed UltraSoC’s embedded…

Hyperstone announces Shinden Hightex Corporation as Distribution Partner

8 years ago

To increase the company’s presence in Japan, German semiconductor company Hyperstone announced today that it has appointed Shinden Hightex Corporation…