Qualcomm Snapdragon 675 Mobile Platform Brings Outstanding Gaming with Advanced AI and Cutting-Edge Camera Performance to Consumers in Early 2019

8 years ago

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ:QCOM), has introduced the new Qualcomm® Snapdragon™ 675  Mobile Platform. The Snapdragon…

Volkswagen, Mobileye and Champion Motors to Invest in Israel and Deploy First Autonomous EV Ride-Hailing Service

8 years ago

 The Volkswagen Group, Mobileye, an Intel Company, and Champion Motors announced plans to deploy Israel’s first self-driving ride hailing service…

Imec Releases Neuropixels Neural Probe to the global Neuroscience Community

8 years ago

Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, released and is making available its state-of-the-art high-density…

Samsung Introduces Two New 0.8μm ISOCELL Image Sensors to the Smartphone Market

8 years ago

Samsung Electronics, a world leader in advanced semiconductor technology, today introduced two new 0.8-micrometer (μm) pixel image sensors – the…

ON Semiconductor Introduces Mesh Networking and New Development Support for Industry-Leading RSL10 Bluetooth® 5 Radio Family

8 years ago

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has extended the capabilities of its RSL10 family of Bluetooth 5 certified…

Toshiba announces Bluetooth® 5 IC for automotive applications

8 years ago

Toshiba Electronics Europe (“Toshiba”) has announced a new Bluetooth® IC for automotive applications will be added to their IC line-up.…

INDO DEFENCE 2018: Rohde & Schwarz presents innovative portfolio of communications and intelligence systems

8 years ago

In Jakarta, Rohde & Schwarz will present itself as a single-source supplier of integrated solutions for secure communications and radio intelligence. Interoperable,…

New Connected-Car Automotive MCU from STMicroelectronics Enables Secure Remote Updates and High-Speed In-Vehicle Networking

8 years ago

STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, is making connected cars safer,…

€600 million for Berlin – Siemens signs future pact for Germany as an industrial location

8 years ago

A commitment to Berlin and Germany: at the time-honored Siemens industrial estate in Berlin's Spandau district, Siemens AG plans to…

TI introduces first multiprotocol gigabit TSN-enabled processors for Industry 4.0

8 years ago

 Texas Instruments (TI) (NASDAQ: TXN) today announced the industry's first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new,…