Teledyne e2v, a Teledyne Technologies company, has reached a significant milestone in the Flexible Combined Imager (FCI) instrument program with…
STMicroelectronics’ PWD5F60 high-density power driver is the second in a new series of power-driver systems-in-package addressing high-voltage brushed DC and single-phase brushless…
IC Insights’ November Update to The 2018 McClean Report will present an in-depth analysis and detailed five-year forecast for the IC Industry, which is…
MUNICH, Germany – November 6, 2018 – Designers striving to bring greater intelligence into Industry 4.0 digital factory equipment while…
MUNICH, Germany – November 6, 2018 – Designers of industrial equipment striving to meet the size, power and performance requirements…
This week at Vision 2018 (November 6-8 2018), imec, the world-leading research and innovation hub in nanoelectronics and digital technologies,…
Volvo Cars has reached an agreement with Baidu, the leading Chinese internet search provider, to jointly develop electric and fully…
The FRAMOS® Group, leading global supplier of imaging products, custom vision solutions and OEM services, launches their Embedded Vision (EV)…
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that Wi-SUN Alliance1 has adopted Renesas’…
November 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces the launch of its…