The one- to four-position 9176-800 Series low-profile IDCs now accommodate 22–28AWG to deliver high-reliability performance in an expanded range of…
This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research and innovation hub in nanoelectronics…
Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced that it has expanded its portfolio of Internet of…
PLDA, the industry leader in PCI Express® controller IP solutions and Samtec, a privately held $800MM global manufacturer of a…
Toshiba Electronics Europe (“Toshiba”) today announced the launch of an addition to its line-up of dual H-bridge driver ICs for…
Stuttgart – Daimler is taking the next step towards securing its CASE corporate strategy. The company already plays a leading…
Working with a number of partners on the BodySense project, CPI is supporting the development of next generation multi-functional sensing…
Rohde & Schwarz has signed a procurement and maintenance contract with the Defense Acquisition and Logistics Organization (DALO) of the Danish…
Samsung Electronics announced today that it has partnered with three prominent global museums and art galleries, Uffizi Galleries (Italy), Museum…
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company, has completed a multi-million dollar project by delivering hundreds of CCD250 sensors…