Samtec to Showcase High-Performance Interconnects at electronica 2024

Samtec will take customer meetings and demonstrate high-density optical, copper, and RF interconnects in booths B2-219 and B2-119.

Samtec, Inc., the service leader in the connector industry, will be demonstrating next-generation, high-performance optical and copper interconnect solutions at electronica 2024, the world’s leading trade fair that provides a comprehensive product and technology update for all fields of electronics. Occurring every two years, electronica (12-15 November) attracts approximately 70,000 attendees to Munich, Germany from over 100 countries. Samtec regularly exhibits at electronica and this year will have live booth demonstrations of industry-leading interconnect products and technology.

In booths B2-219 and B2-119, Samtec will be showcasing high-speed, high-density interconnects that are well suited for use in datacenters, AI/high-performance computing, instrumentation, aerospace/defense, and telecom/edge applications up to 224 Gbps and 110 GHz.

Products featured include the new Si-FLY^® HD high-density Flyover^® system, URSA^® I/O ultra-rugged cable system, AcceleRate^® extreme density and performance systems, and Halo™ next-gen 56 Gbps optical system for optical or copper interconnects, CXL^® over optics, and PCIe^®. Demonstrations include high-performance mid-board, front-panel, and back-panel systems as well as precision RF products, including the sought-after BE90A Bulls Eye^® test system, Magnum RF^® ganged solution, and newly released distinctive Samtec orange Nitrowave™ RF microwave cable assemblies that maintain phase and amplitude stability with flexure.

Credut:Samtec