LATEST NEWS

AC/DC flyback controllers from Nexperia enable higher power density GaN-based flyback converters

Controllers improve power efficiency and also reduce standby power consumption

Nexperia today introduced a new series of AC/DC flyback controllers as the latest additions to its continuously expanding portfolio of power ICs. The NEX806/8xx and NEX8180x are designed for GaN-based flyback converters in devices such as power delivery (PD) chargers, adapters, wall sockets, strip sockets, industrial power and auxiliary power supplies, and other AC/DC conversion applications requiring high power density.

The NEX806xx/NEX808xx are quasi-resonant/multi-mode flyback controllers which operate from a wide VCC range (10-83V), while the NEX81801/NEX81802 are adaptive synchronous rectifier controllers. These ICs can be used in combination with Nexperia’s NEX52xxx PD controllers and other discrete power devices to deliver a turn-key flyback converter solution that optimizes the current sense voltage level and PFM mode, reduces standby power, and achieves high efficiency across the entire load range. The primary side controller can be used to drive a silicon MOSFET or GaN high electron mobility transistor (HEMT) directly, which helps to improve power density, while the synchronous rectification (SR) controller utilizes an innovative adaptive control method to eliminate the possibility of mis-conduction of switching device, thereby improving overall system reliability.

This family of flyback controller ICs employs the TSOT23-6 flip-chip package to deliver better thermal performance and which also helps to prevent accidental triggering of the over temperature protection (OTP) function. The control circuit also includes additional protection features, making it ideally suited for use in consumer and industrial flyback power supply designs.

To learn more about Nexperia’s flyback controllers, visit www.nexperia.com/ac_dc_controller


Credit:Nexperia

Danit

Recent Posts

Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets

Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging…

2 days ago

NVIDIA Acquires Open-Source Workload Management Provider SchedMD

NVIDIA will continue to distribute SchedMD’s open-source, vendor-neutral Slurm software, ensuring wide availability for high-performance…

2 days ago

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

4 days ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

7 days ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

7 days ago

Port Raises $100M Series C to Power Agentic Engineering Platform

General Atlantic leads round valuing company at $800M as Port tackles the 90% of developer…

7 days ago