Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration. Honda selects Infineon as semiconductor partner to align future product and technology roadmaps. The two companies also agreed to continue discussions on supply stability, as well as to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies.
“Infineon’s system understanding, our broad product portfolio and outstanding quality have made us an appreciated partner to Japan’s automotive industry,” said Peter Schiefer, President of the Automotive Division at Infineon. “We are honored to be the semiconductor partner for a strategic collaboration with Honda. Intensifying a long-standing partnership even further is always a confirmation of the added value created and at the same time an expression of the trust in contributing to future successes.”
Infineon will support Honda with technologies to enable competitive and advanced vehicles. The technical support will focus on the area of power semiconductors, Advanced Driver Assistance Systems (ADAS), and E/E architectures, where both parties will collaborate on new architecture concepts.
Credit: Inifneon
First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…
The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…
OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…
Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…
LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…