NEW PRODUCTS

 Vicor to unveil breakthrough modular solution for inverter ripple currents in EV power delivery networks at EEHE 2023

Vicor will demonstrate how to reduce the impact of traction inverter ripple in electric vehicles using power modules on June 13-14 in Essen, Germany

London, UK – 17 May 2023 – Vicor, the leader in high‑performance power modules, today announces its participation at Electronic & Electrical Systems in Hybrid & Electric vehicles (EEHE) 2023 in Essen, Germany. As one of Europe’s leading vehicle electrification conferences, EEHE takes place on 13 – 14 June and targets manufacturers, suppliers, development partners and employees of universities and research institutions. The event hosts presentations that examine a range of topics including architectures and components for electrification, on-board energy networks, electric charging infrastructure, electrical energy management, low-voltage storage, battery management and power electronics.  Vicor high-density power modules address a variety of automotive electrification challenges including EV fast charging, high voltage battery conversion and bridging 48V-12V systems.

Haris Muhedinovic, Principle Field Application Engineer, Vicor, will present at 09:10AM on Wednesday 14 June. His talk will focus on the problems that inverter ripple currents and voltage create for the DC/DC converter and its input filter in electric vehicles. It highlights some of the challenges encountered and proposes a highly efficient modular power solution using high bandwidth DC/DC converter that operates above 1MHz.

“EEHE has always been a primary target for us so we’re looking forward to connecting with customers and OEMs through the solutions in our presentation,” says Muhedinovic. “Vicor’s lightweight power modules offers the automotive market flexibility and scalability, and I feel this presentation will enable us to showcase our trusted expertise in the market too.”

Visitors can register to attend Vicor’s presentation via the EEHE website.


 

Liat

Recent Posts

Beyond Copper: Why Integrated Photonics Is Key to Scaling AI Infrastructure

The collaboration between Tower Semiconductor and Scintil Photonics offers a clear view into the future…

4 days ago

Engineering AI: Why Physical AI Is Becoming an Industrial Foundation

How virtual twins, accelerated computing and physics-based models are turning AI from smart software into…

4 days ago

Cellular from Space: The RF Challenge Behind Direct-to-Device Connectivity

For decades, cellular communication has relied on one almost unquestioned assumption: the base station is…

4 days ago

IBM Quantum Computer Accurately Simulates Real Magnetic Materials, Reproducing National Laboratory Data

IBM (NYSE: IBM) today announced new results that its quantum computer can simulate real magnetic materials…

4 days ago

Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology

Arrow Electronics has announced the launch of a new evaluation platform, jointly designed in collaboration…

5 days ago

Siemens introduces AI-powered on-premises analytics for industrial drivetrain systems

Siemens has unveiled Drivetrain Analyzer Onsite, a new on-premises analytics solution for industrial drive systems,…

5 days ago