Addressing growing customer demands for a greater breadth of size options
Portsmouth, UK, December 2020 – To complement its 1mm diameter terminal pins, Harwin now offers a range of 1.75mm diameter options. These pins will be suitable for use with larger sized sockets where a single connection is required.
The new terminal pins have a current rating of over 9A, making them suitable for power applications. Thanks to their compatibility with Harwin’s existing portfolio of single contact sockets, they are straightforward to implement into a mating pair. They can act, for example, as mating pins for the larger SYCAMORE Contacts, or the company’s twin beam surface mount PCB socket.
The Harwin terminal pins are intended for through-board soldering onto 1.6mm thickness PCBs. They are available in versions with heights above the board of 5mm, 8.1mm, 9.5mm, 15.3mm and 21.65mm. As a result, they can accommodate wide variations in board-to-board distances, which are generally to be expected because of production tolerances. This means that other connections on the board that can only accept minimal differences in the spacing between PCBs may be fully maintained, and not put under any additional pressure. Supplied with either tin or gold finishes, these items exhibit a high degree of durability and ensure a prolonged working lifespan.
“We’ve seen growing demand from users of our larger SYCAMORE and SMT sockets in applications such as electric vehicle charging, but to date there have only been a very limited number of suitable terminal pins on the market. So we made the decision to support our customers by introducing larger diameter terminal pins, alongside our existing products,” notes Neil Moore, Product Manager for EMC & Industrial Connectors at Harwin. “This means that customers struggling to find an appropriate solution can now come directly to us. We can see definite opportunities for these new terminal pins in a multitude of sectors, including metering, instrumentation, satellites and robotics.”
Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…
Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…
The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…
The first unmanned ground systems left the production line only 12 weeks after the two…
The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…
The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…