NEW PRODUCTS

Tailored to perform in resonant topologies: the new 650 V CoolMOS™ CFD7

Munich, Germany – 1 October 2020 – For SMPS designs in industrial applications recent technology trends include the need for high efficiency and power density as well as increased bus voltages. This triggers the need for power devices with 650 V breakdown voltage. With its 650 V CoolMOS™ CFD7 product family Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) meets these demands. The devices are best suited for resonant topologies in soft-switching applications like telecomserversolar and off-board EV-charging.

Extending the voltage range of the renowned CoolMOS CFD7 family the 650 V device succeeds the CoolMOS CFD2. The added 650 V products match LLC and zero-voltage-switching phase-shift full-bridge topologies in which they are delivering numerous advantages compared to previous generations. The additional 50 V breakdown voltage, an integrated fast body diode, and improved switching performance make the product family a perfect fit for contemporary designs. Very low reverse-recovery charge and excellent thermal behavior add to the benefits.

The switching losses, as well as RDS(on) dependency over-temperature, are significantly reduced. The product family provides very good hard-commutation ruggedness. Thanks to the improved gate charge (Q g) and the fast switching performance, the 650 V CoolMOS CFD7 family increases efficiency over the whole load range. In the primarily targeted SMPS application, these MOSFETs provide outstanding light-load and improved full-load efficiency compared to the competition. Furthermore, the best-in-class R DS(on) enables customers to increase the power density level of SMPS at a competitive price.

Availability

The 650 V CoolMOS CFD7 in TO-220, TO-247, and TO-247 4-pin packages can be ordered now. More information is available at www.infineon.com/650V-CFD7.


SIVAN

Recent Posts

NewPhotonics® and Tower Semiconductor Begin High-Volume Shipments of Laser-Integrated, Serviceable Optical Engine PICs for Scale-Out and Scale Up AI Interconnect

Companies commercialize scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA…

7 hours ago

Samtec 1.0 mm Connectors Capable of DC to 120 GHz

Samtec, Inc., the service leader in the connector industry, announces the release of its 1.0…

1 day ago

LaFontaine Automotive Group Partners with UVeye to Offer Complimentary AI Vehicle Safety Scans Across Michigan

LaFontaine’s 40+ locations across Michigan will bring UVeye’s “MRI for Cars” technology closer to drivers…

2 days ago

Startup ChikChak Market Launches Israel’s first Reels-Based Marketplace for Secondhand Goods

After 3 years of development by alumni of TikTok and Google, the Israeli startup is…

2 days ago

Analog Devices to Acquire Alif Semiconductor for $1.35 Billion, Expanding Its Edge AI Platform

The planned acquisition will combine Analog Devices’ sensing, signal-processing, power and connectivity technologies with Alif’s…

4 days ago

Kyocera and Tohoku University Integrate Optical Isolator Directly on Silicon Photonics

A locally applied laser-annealing process enabled the researchers to crystallise magneto-optical garnet without exposing the…

4 days ago