congatec – a leading vendor of embedded computing technology – and international electronic component distributor SE Spezial-Electronic are pleased to announce that they have signed a distribution agreement. SE Spezial-Electronic will now distribute the entire congatec product portfolio. The non-exclusive distribution agreement covers the entire DACH region as well as Poland and Great Britain.
“Computer-on-Modules and industrial single board computers from congatec are an attractive addition to SE Spezial-Electronic‘s memory and display offerings. The created synergies are excellent and have great potential to benefit customers. SE Spezial-Electronic is therefore predestined to become a strong sales channel partner,” says Diethard Fent, Sales Partner Manager EMEA at congatec.
“We are very pleased that our sales partnership with congatec will allow us greater access into the core of embedded applications,” comments Christopher Wuttke, CEO of SE Spezial-Electronic. “It marks a highlight in this special year – in which SE celebrates its 50th anniversary – to be able to add another really attractive product area and partner to our portfolio.”
The line managers of the new Embedded Group at SE Spezial-Electronic, Johannes Lange, Benjamin Bräuer and Jean-Paul Thom, also see significant synergies between their current product areas and the congatec solutions. “With congatec, we now have a five-star partner from Germany at our side who is the market leader in the field of Computer-on-Modules, provides innovative products and shares our philosophy of full development support. This enables us to provide our customers with an even more extensive choice of products,” adds Marius Wüstefeld, head of Inside Sales at SE Spezial-Electronic.
In addition to Computer-on-Modules and single board computers from congatec, SE Spezial-Electronic’s embedded offering includes sensor technology, storage solutions, displays, GNSS solutions and products for wireless communication (Bluetooth & WiFi).
Main photo: FLTR: Diethard Fent (congatec),
Christopher Wuttke (SE), Roland Judith (congatec)
Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…
Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…
The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…
The first unmanned ground systems left the production line only 12 weeks after the two…
The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…
The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…