LATEST NEWS

Ericsson RAN processes fully compliant with new 3GPP/GSMA NESAS network security global standards

Security has been fundamental to the research, design and development of Ericsson 5G RAN from the outset and is central to Ericsson Radio System products and solutions. Now, Ericsson’s Radio Access Network (RAN) technology development processes are fully compliant with the new 3GPP/GSMA Network Security Assurance Schemes (NESAS) standards.

NESAS is jointly defined by 3GPP and the GSMA and provides an industry-wide security assurance framework. This facilitates improvements in security levels through 20 defined security requirements for the development and product lifecycle processes of network products.

Security has always been crucial for 3GPP standards and telecom networks in general. Both through security functionality, having kept 3GPP-defined mobile services secure for decades and with billions of users, but also through instruments such as NESAS/SECAM security assurance and security.

Furthermore, the introduction of 5G and its new use cases, as well as the growing recognition of telecom networks as critical infrastructure, have also put network security high on the agenda of governments, regulatory bodies, communications services providers and businesses of all sizes.

Per Narvinger, Head of Product Area Networks, Ericsson, says: “Our security assurance framework is an important part of us doing business in responsible way, and we are pleased to announce that we are fully compliant with the new NESAS network security global standards. 5G is a critical national infrastructure that provides extraordinary innovation possibilities and security is vital for 5G’s deployment across the world. We will continue to work tirelessly to drive open, global and interoperable security standards.”

Ericsson’s NESAS compliance processes underwent a complete audit by a GSMA-approved, independent auditor.

Liat

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

5 days ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

5 days ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

6 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

6 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

1 week ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

1 week ago