LATEST NEWS

Durable Industrial Board-to-Board Connectors from Harwin Tested to 3Gbits/s Operation

Harwin has confirmed that its Archer Kontrol 1.27mm pitch board-to-board connectors support data rates of up to 3Gbits/s. Compatible with Ethernet speeds up to 2.94Gbits/s, these connectors are optimised for modern industrial infrastructure.

Targeting the industrial drives and controls market, the Archer Kontrol series is also proving highly effective in monitoring and data acquisition equipment. Mated connectors withstand 20G of vibration, coping with the demanding conditions of automation and mechanized processes. The fully shrouded and polarized design handles strong lateral and twisting forces, and surface mount hold-downs lighten the strain on the soldered connections. Blind mating is easy to do, thanks to the generously chamfered front edges – allowing up to 0.7mm offset. The gold-plated phosphor bronze contact areas enable these connectors to handle up to 500 mating cycles. With operating temperatures reaching 125°C, they are a safe choice for small to large industrial equipment connections.

The Archer Kontrol series covers pin counts of 12 to 80 contacts and variable vertical connector heights allow board-to-board spacings of 8mm to 20mm. With both vertical and horizontal connectors in male and female designs, all mating configurations are possible – edge-to-edge co-planar, parallel board-to-board and right-angle mother-to-daughterboard. Easy blind mating along with right angle connection means these components are well suited to backplane connections. Up to 1.2A current per contact is supported.

The combination of 3Gbits/s data rate with mechanical robustness ensures the long-term integrity of high-speed industrial data. Archer Kontrol helps maintain system responsiveness and minimize downtime to keep production lines running.


SIVAN

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

3 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

3 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

3 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

3 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

3 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

3 days ago