LATEST NEWS

Anritsu and EMITE announce 802.11ax TRP/TIS OTA Test Platform

Luton, United Kingdom, April 1, 2020 – Anritsu and EMITE are proud to announce their latest combined solution for testing the latest IEEE 802.11 WLAN standard. The new Anritsu Wireless Connectivity Test Set MT8862A has been successfully integrated in combination to the EMITE E600 Reverberation Chamber to test OTA TRP/TIS performance of IEEE 802.11ax devices in a repeatable environment. With built-in communications protocols and optimized performance for WLAN testing, the MT8862A + EMITE reverberation chamber can characterize with high reliability the performance of the latest devices in the market.

The new integration has been able to successfully measure total radiated power (TRP) and total isotropic sensitivity (TIS) OTA performance for IEEE 802.11ax devices. Being able to test the latest WLAN standards keep EMITE and Anritsu in the edge of technology for helping customers and service providers deliver their WLAN solutions to the market with total confidence in the performance.

“We are proud once again to develop a world’s first capability for testing 802.11ax Over-The-Air with the aid of Anritsu’s unique Wireless Connectivity Test Set MT8862A and our E600 Reverberation Chamber WLAN OTA test platform. The unique capabilities of the Anritsu-EMITE WLAN OTA Test Platform cannot be met by competitors, and some of our major customers have already shown extreme interest”, said David Sánchez, CEO of EMITE.

“WLAN OTA performance test demand is recently increasing in order to secure the brand position with high-quality WLAN products. The IEE802.11ax will be a standard WLAN technology in the future from the latest technologies and features viewpoint, and we are also proud to release the OTA test solution collaborated with EMITE’s leading-edge chamber products to the world-wide market”, said Hideo. Zuinen, Product Manager, IoT Test Solutions Div., Anritsu Corporation.


SIVAN

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

16 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

16 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

16 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

16 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

16 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

16 hours ago