LATEST NEWS

ROHM Group Company SiCrystal and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

Agreement will boost industrial flexibility and support commercial expansion of  SiC products in automotive and industrial applications

ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe. The agreement governs the supply of over 120 million dollars of advanced 150mm silicon carbide wafers by SiCrystal to STMicroelectronics during this period of demand ramp-up for silicon carbide power devices.

This additional long-term SiC substrate supply agreement comes on top of the external capacity we have already secured and the internal capacity we are ramping. It will enable ST to increase the volume and balance of the wafers we will need to meet the strong demand ramp-up from customers for automotive and industrial programs over the next years”, said Jean-Marc Chery, President and CEO of STMicroelectronics.

“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC wafers for many years. We are very pleased to enter into this supply agreement with our longstanding customer ST. We will continue to support our partner to expand silicon carbide business by ramping up wafer quantities continuously and by providing reliable quality at all times”, said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.

The adoption of power solutions with SiCs is accelerating in both the automotive and industrial markets. With this agreement, the two companies will contribute to the widespread use of SiC in these markets.


SIVAN

Recent Posts

German Defence Force Expands Use of Driving Robots for Driverless Testing

The Bundeswehr acquires a fourth Automated Driverless Testing Solution from AB Dynamics The solution removes…

1 day ago

Infineon introduces ultra-low noise XENSIV™ TLE4978 hybrid Hall and coil current sensor for next-generation power systems

Munich, Germany – 17 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)…

1 day ago

Menlo Micro and Rosenberger partner to develop cryogenic switching module for quantum computing

Menlo Microsystems and Rosenberger have announced a strategic partnership to develop a multichannel ultra-low power…

2 days ago

Infineon strengthens leadership in the global microcontroller market

Infineon Technologies continues to strengthen its position as the global leader in the microcontroller (MCU)…

2 days ago

Tesla explores chip manufacturing initiative to support next-generation AI and autonomous systems

Tesla is reportedly exploring plans to expand its semiconductor capabilities as part of a broader…

2 days ago

Israeli Tech Company AU10TIX Is Getting Ahead of Identity Fraud Before It Happens

Identity fraud has outpaced the tools businesses once relied on to fight it, so being…

2 days ago