Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019.
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted.
Demonstrations:
Technical Sessions:
1:00 PM Tuesday, June 18, 2019 – Kevin Burt Sr. System Architect – Optical Systems
11:30 AM Wednesday, June 19, 2019 – Steve Krooswyk Sr. SI Engineer
The demonstrations can be seen in the Samtec booth at PCI-SIG Developers Conference 2019 at the Santa Clara (CA) Convention Center. The conference is June 18-19, 2019.
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