LATEST NEWS

RF antenna module uses optimised antenna beamforming for next generation high speed wireless networks

Murata has released a high gain antenna module that facilitates communication up to 4.62 Gbps. The new millimeter-wave RF antenna module will contribute to the creation of next generation wireless networks that utilise the 60 GHz frequency by supporting the IEEE802.11ad millimeter-wave wireless LAN standard.

The need is growing for faster internet communications in line with the increase in bandwidth required by internet contents such as ultraa-high definition (HD, 4K) video, augmented reality (AR), and virtual reality (VR). In addition, constructing wired networks that cover wide areas requires enormous amounts of cables and labour, and the costs of constructing and maintaining this infrastructure are also considerable.

Dubbed LBKA0ZZ1NH-317, the new module is anticipated to be utilised in a wide range of applications such as for communication between mobile phone base stations including next-generation 5G wireless communication, for communication between Wi-Fi hotspots, and for use in wireless communication networks in smart cities.

Murata’s RF module realises optimised antenna beamforming using a proprietary low temperature co-fired ceramics (LTCC) circuit board capable of facilitating high-precision 60 GHz band communication. In addition to communication via a standalone module, by combining multiple modules it is possible to extend the communication range and link outdoor base stations several hundred meters apart for multi-gigabit communication. The LTCC circuit board’s high heat resistance and low moisture absorption ensure excellent operational reliability and enable use even in outdoor base station environments.

The highly efficient antenna module operation realises low transmission line loss between the IC and the antenna thanks to the low-loss material characteristics of the LTCC. The modularised RFIC and antenna package eliminates the need to design new millimeter-wave RF circuitry, which reduces the amount of labour required for developing new network equipment.

The module exhibits a high gain of 37.5 dBm typical EIRP with CW signal and saturated power. The RFIC in the module is able to support multi-tile RF module operation. It helps users get higher output power, better Rx sensitivity and longer communication distance.

Lihi

Recent Posts

Beyond Copper: Why Integrated Photonics Is Key to Scaling AI Infrastructure

The collaboration between Tower Semiconductor and Scintil Photonics offers a clear view into the future…

3 days ago

Engineering AI: Why Physical AI Is Becoming an Industrial Foundation

How virtual twins, accelerated computing and physics-based models are turning AI from smart software into…

3 days ago

Cellular from Space: The RF Challenge Behind Direct-to-Device Connectivity

For decades, cellular communication has relied on one almost unquestioned assumption: the base station is…

3 days ago

IBM Quantum Computer Accurately Simulates Real Magnetic Materials, Reproducing National Laboratory Data

IBM (NYSE: IBM) today announced new results that its quantum computer can simulate real magnetic materials…

3 days ago

Arrow Electronics Announces New Single Pair Ethernet Reference Design Featuring Bourns, Microchip and Amphenol Technology

Arrow Electronics has announced the launch of a new evaluation platform, jointly designed in collaboration…

4 days ago

Siemens introduces AI-powered on-premises analytics for industrial drivetrain systems

Siemens has unveiled Drivetrain Analyzer Onsite, a new on-premises analytics solution for industrial drive systems,…

4 days ago