LATEST NEWS

PragmatIC and S&S smooth the way for ultra low cost printed RFID

Strategic collaboration to minimise up-front cost for novel RFID solutions.

PragmatIC, a world leader in ultra-low cost flexible electronics, and Smooth & Sharp Corporation (S&S), a major supplier of RFID inlays and manufacturing tools, are pleased to announce a strategic collaboration which will accelerate the adoption of PragmatIC’s flexible integrated circuits (FlexICs).

S&S has significant experience designing manufacturing equipment for traditional silicon inlays, which they have adapted to deliver a new flip-chip machine for PragmatIC’s unique FlexICs. With a throughput of 4,200 UPH (parts per hour), the new machine offers the lowest up-front cost for assembly of FlexICs onto paper or plastic inlays.

The new machine has been demonstrated not only with conventional aluminium antennas, but also a range of antennas produced by S&S using flexographic, inkjet and screen printing. The availability of printed electronic solutions further lowers the cost barrier for RFID inlays.

This radical change in cost, coupled with the incredibly thin, flexible and robust nature of FlexICs, opens up the potential for consumer goods brands to rapidly adopt and scale new smart packaging solutions based on RFID and NFC functionality.

“We are very excited that Smooth & Sharp Corporation are delivering solutions that enable the integration of our unique technology for ultra-low cost flexible electronics” said Scott White, CEO of PragmatIC. “Our strong portfolio of partners, including our global RFID and NFC inlay manufacturers, ensures that the worlds’ largest consumer brands can now add intelligence into everyday items.”

“Smooth & Sharp Corporation is focused on delivering the best solutions for our customers” commented Alan Wu, CEO of S&S. “Combining PragmatIC’s novel FlexICs with our printed antennas on low cost substrates will bring significant advantages for customers who want to add RFID and NFC to a more diverse range of inexpensive products.”

Liat

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

22 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

22 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

22 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

22 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

22 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

23 hours ago