LATEST NEWS

Teledyne e2v announces full HD CMOS image sensor for low-cost machine vision

New Emerald 2M image sensor featuring MIPI interface

Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces the expansion of its Emerald family of image sensors with a new 2 Megapixel sensor. Emerald 2M is a new CMOS image sensor designed for cost-sensitive applications that require full HD resolution images of objects in motion, without distortion. The sensor is optimized for machine vision applications and includes 5° Chief Ray Angle compensation. The Emerald 2M is offered in a high performance CLGA package or miniaturized organic fan-out package that is only 1.19 mm thick.

As the smallest full HD global shutter sensor available, Emerald 2M helps to lower the cost of a full HD camera system because of its compatibility with low-cost 1/3” optics.

Emerald 2M provides flexibility to R&D engineers with its global shutter and MIPI CSI-2 interface, which allow it to utilize the latest Image Signal Processors (ISP) available for mobile applications. Digital functionalities (multi region of interest, subsampling, auto exposure at first frame, single frame HDR and on-chip statistics) are also embedded in the sensor to reduce processor load and hasten time-to-market.

The Emerald family of small global shutter CMOS image sensors address a range of machine vision applications and this 2M device has the smallest footprint. Emerald image sensors are also available in resolutions of 8, 12, 16, and 67 Megapixels.

Key features:

  • Global shutter CMOS pixel (2.8μm x 2.8μm) optimized for a maximum 5° Chief Ray Angle
  • 1/3” optical format
  • MIPI CSI-2 interface, up to 100fps
  • Package options: CLGA or fan-out organic package
  • Color Filter Array options: monochrome or color Bayer
  • On-chip functionalities: multi ROI, subsampling, single frame exposure, single frame HDR

Samples are available in Q2 2019. Please visit the product page or contact us for more information. You can also visit the team at Vision, Stuttgart on booth 1F62, 6-8 November 2018.

Liat

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

1 day ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

1 day ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

2 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

2 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

3 days ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

4 days ago