Power Solutions

Absolute Encoder Series Adds Multi-Turn Output Option

TUALATIN, Ore. — October 16, 2018 — CUI’s Motion Group today announced that its AMT21 series of absolute modular encoders has added models with multi-turn output capability. Offering 12 bits or 14 bits of absolute position information, the multi-turn AMT21 series implements a 14-bit signed number turns counter for applications rotating beyond 360 degrees. These features provide users with the ability to keep track of position even during power down conditions, while the turns counter can be maintained via a battery backup, eliminating the need for a homing sequence.

Based on CUI’s patented capacitive ASIC technology, the AMT21 series is highly durable and accurate with resilience to the dirt, dust, and oil typically found in motion applications. Its high-speed RS-485 protocol for fast and low latency position data is accompanied by a low current draw of 8 mA at 5 V and a compact package with locking hub for ease of installation. Boasting accuracy of ±0.2 mechanical degrees, the AMT21 series further carries an operating temperature range from -40 to +105°C in either radial or axial orientations.

The digital nature of the AMT21 series also allows users to configure the alignment via CUI’s AMT Viewpoint™ GUI or the encoder’s RS-485 protocol. Additionally, the digital interface of the AMT21 encoder can be used to set addresses for multiple encoders sharing the RS-485 bus.

The AMT21 series is available immediately with prices starting at $49.72 per unit at 50 pieces through distribution. Please contact CUI for OEM pricing.

Summary
Product name: AMT21 Series
Availability: Stock to 5 weeks
Possible users: Industrial, robotics, battery-powered, automation applications
Primary features: Multi-turn output, 12 or 14-bit resolution, compact package
Cost: $49.72 per unit at 50 pieces through distribution

View details for the AMT21 series

Liat

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

3 days ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

3 days ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

3 days ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

3 days ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

3 days ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

3 days ago