LATEST NEWS

Ericsson and Singtel achieve Asia’s fastest five-carrier aggregation on LTE

Singtel will gradually deploy the new speed across the island as more spectrum bands are allocated for the LTE network. Smartphones supporting 1.5 Gbps speeds are scheduled to be launched in 2019.

“We are constantly investing in innovative technologies to boost network speeds, enhance coverage and expand capacity to give our customers the best network experience,” said Mr Yuen Kuan Moon, Chief Executive Officer, Consumer Singapore and Group Chief Digital Officer at Singtel. “As our customers’ lifestyles increasingly revolve around their smartphones, we do our best to ensure they enjoy fast, reliable, comprehensive and secure connectivity.”

The enhanced network speed was achieved in collaboration with Ericsson with a first-of-its-kind carrier aggregation of five carriers, which boosts network bandwidth. A combination of two 1800 MHz frequencies, together with 2100 MHz, 2600 MHz and TDD 2500 MHz spectrum bands and technologies such as FDD & TDD, 256QAM and 4X4 MIMO was used to achieve the peak speed of 1.5 Gbps. When introduced in the live network, such capability improves user experience and enhances network capacity. For instance, customers can download a two-hour 4K video in eight minutes.

“Ericsson has been a leader in pioneering technologies,” said Mr Martin Wiktorin, Head of Ericsson Singapore, Brunei & the Philippines. “By leveraging five-carrier aggregation across both FDD & TDD, we continue to lead the way to meet customers speed and capacity demands. We are proud to be working on new capabilities and advancements on LTE.”

Singtel and Ericsson will launch a pilot 5G network in Singapore in the fourth quarter of 2018. Singtel was recently named Asia’s Best Mobile Carrier by Telecom Asia and was recognised by global metrics leader, Ookla, for having the fastest mobile network speeds in Singapore.

Lihi

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

19 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

19 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

20 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

20 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

20 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

20 hours ago