LATEST NEWS

Allegro MicroSystems Announces the Establishment of a New Research and Development Center in the Czech Republic

Allegro MicroSystems (Allegro), a leading supplier of high-performance power and sensor semiconductor ICs, established a new research and development center in the Czech Republic. This new center is currently staffed with two dozen engineers located in Prague. These talented engineers will accelerate Allegro’s development of market leading, innovative ICs for both the automotive and industrial markets. The team will initially focus on developing sensor ICs for electrified vehicles, green energy, and high-efficiency industrial motor applications.

“We are very excited to formally open our new R&D center in Prague. We were fortunate to hire an excellent team of engineers. This high performing team is already accelerating Allegro’s leadership position in both the automotive and industrial markets,” said Michael Doogue, Vice President of Business Development and Advanced Sensor Technologies at Allegro MicroSystems. “We plan to hire an additional 20 to 30 engineers at the center over the next few years. The Prague team is an important addition to Allegro’s global product development team, and I am certain that they will have a positive impact on Allegro’s product development velocity and our customer support levels for many years to come.”

The availability of highly skilled IC design, systems, and software engineers was a major contributor to Allegro’s decision to open this new R&D center in Prague. The area provides an optimum combination of experienced engineers and recent graduates from local universities.

Allegro’s new location in Prague also offers a contemporary work environment, excellent amenities, a beautiful view of the city, walking and running trails and a full-service café. For more information on open positions at this R&D center, visit Allegro’s website at www.allegromicro.com.

Liat

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

3 days ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

3 days ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

4 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

4 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

5 days ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

6 days ago