Connectors & Cables

Female Power Contacts for 2mm Pitch Connectors

Harwin has announced the introduction of a new female contact for its Datamate connectors that enables significant increases in power delivery levels to be realized. Utilizing a unique, proprietary 6-finger design which is machined from a single piece of beryllium copper, the T-Contact raises the current capacity on compact 2mm pitch interconnection systems, with up to 8.5A per contact being supported. As a consequence, it further improves the size, weight and power (SWaP) parameters of the company’s popular Datamate offering, and addresses the growing need for engineers to ramp up the power in modern space-constrained designs.

The innovative patented design employed in these components presents more contact points, which thereby enhances their resilience to shock (100G) and vibrational forces (40G for 6 hours – 2 hours on each axis). The crimp barrels accept 22AWG wire and comply with IPC-A-620 cable harnessing specifications. The contacts are also gold plated in order to ensure that reliable performance is maintained in even the most demanding of application environments (allowing US military requirements to be met, etc.). It also means that a far greater number of mating cycles (up to 1000) can be undertaken, thereby extending the operation lifespan of connectors into which they are incorporated. Their operational temperature range spans from -55°C to +125°C.

The T-Contact exhibits 60% greater contact wipe compared to existing Datamate contacts – which improves the self-cleaning action and reduces the possibility of surface contamination arising. To accompany these groundbreaking contacts, Harwin supplies a variety of dual-row housings with different jackscrews which are available direct from stock in a broad range of different sizes, from 4 to 50 position options.

Among their main target applications are defense, avionics (control systems, radar, UAVs, etc.), motorsport (navigation systems, sensors, telemetry equipment), industrial automation (drives/controls, robotics, motion control systems) and satellites.

Liat

Recent Posts

Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets

Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging…

5 days ago

NVIDIA Acquires Open-Source Workload Management Provider SchedMD

NVIDIA will continue to distribute SchedMD’s open-source, vendor-neutral Slurm software, ensuring wide availability for high-performance…

5 days ago

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

7 days ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

1 week ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

1 week ago

Port Raises $100M Series C to Power Agentic Engineering Platform

General Atlantic leads round valuing company at $800M as Port tackles the 90% of developer…

1 week ago