Power Solutions

Ultra-Compact 3 W Wall Plug Adapters Meet DoE Level VI and CoC Tier 2 Efficiency Standards

CUI’s Power Group today introduced four new series of 3 W wall plug power adapters to its portfolio of DoE Level VI and CoC Tier 2 compliant external power supplies. The SWI3‑N and SWI3‑N‑USB series, available with North American input blades, and the SWI3‑E and SWI3‑E‑USB series, featuring European input blades, are all certified to meet the current average efficiency and no-load power requirements enforced by the US Department of Energy’s (DoE) Level VI standards. The new series are also designed to meet the European Union’s proposed CoC Tier 2 directive, under review to become law in 2018, which looks to further tighten the efficiency requirements enforced by Level VI while adding a new power consumption limit at 10% load levels.

Housed in an ultra-compact case measuring as small as 2.54 x 1.42 x 0.89 inches (64.6 x 36 x 22.5 mm), these external ac-dc power supplies offer 5 Vdc single regulated outputs, a wide universal input voltage range from 90 to 264 Vac, and no-load power consumption less than 0.075 W. Thanks to their ultra-compact design and class II construction, the new models are ideally suited for a wide range of consumer applications, including media players, e-readers, GPS, and other mobile devices.

 The SWI3-N and SWI3-E series feature a range of standard dc output connector options, including micro USB type B, while the SWI3‑N‑USB and SWI3‑E‑USB series incorporate an integrated USB connector. Models with fixed input blades for North American and Japanese applications carry UL/cUL and PSE safety approvals with European fixed blade models carrying CE and GS safety approvals. All of the wall plug adapters offer over current, over voltage, and short circuit protections and comply with FCC Part 15 Class B limits for EMI/EMC.

Liat

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

3 days ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

4 days ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

5 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

5 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

6 days ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

7 days ago