LATEST NEWS

Opening ceremony of external unit of Technical Support Center

Joint activity by Faculty of Electrical Engineering of University of Žilina and ON Semiconductor Slovakia

ŽILINA, Slovakia – Oct. 26, 2017 – ON Semiconductor (Nasdaq: ON) and the University of Zilina (UNIZA) today announced that they will host the opening ceremony of the new external unit of the Technical Support Center (TSC), sponsored by ON Semiconductor on Nov. 2, 2017. This unit will focus on technical support and research projects in the field of microelectronics and provide employment for students, graduates and employees of the faculty. Regional and corporate representatives of ON Semiconductor and UNIZA management will participate in the opening ceremony.

The TSC presence at the facility and at the university links hands-on industrial know-how to academic principles and is meant to encourage intensification of expert knowledge in complex integrated circuits and application solutions of ON Semiconductor and increase interest in technical study programs in Faculty of Electrical Engineering UNIZA.

Prof. Ing. Pavol Špánik, the dean of the Faculty of Electrical Engineering UNIZA, says “I fully support the establishment of TSC and perceive it as an opportunity not only for our students who will have the chance to work on the latest technologies, but also for the Zilina region where it will contribute to development of electro technical industry. The activity fully reflects the current trend at the faculty focused on intense cooperation with the industry.”

“The future of the program is bright!” said Tony Roybal, ON Semiconductor vice president Americas sales. “The composition of the current engineering team that is providing global technical support to our customers largely consists of UNIZA graduates. The expertise and top talent entering into ON Semiconductor from UNIZA will strengthen innovation to key areas of study in the region.”

Liat

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

3 days ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

3 days ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

3 days ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

3 days ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

3 days ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

3 days ago