LATEST NEWS

Most of 2017 Capital Spending Will Go to Foundry and Flash Memory

Spending for DRAM expected to show biggest percentage gain in 2017.

Following a substantial increase in semiconductor capital expenditures during the first half of this year, IC Insights raised its annual semiconductor capex forecast to a record high of $80.9 billion for 2017, a 20% increase from $67.3 billion in 2016.  Previously, 2017 semiconductor capex was expected to grow 12% in 2017 to $75.6 billion.

A little over half of 2017 capex spending is forecast for wafer foundries (28%) and upgrades for NAND flash memory (24%), as shown in Figure 1.  With a projected 53% increase in 2017, the DRAM/SRAM segment is expected to display the largest percentage growth in capital expenditures of the major product types this year.  With DRAM prices surging since the third quarter of 2016, DRAM manufacturers are once again stepping up spending in this segment. Although the majority of this spending is going towards technology advancement, DRAM producer SK Hynix recently admitted that it can no longer keep up with demand by technology advancements alone and needs to begin adding wafer start capacity.

Figure 1

Even with a DRAM spending surge this year, capital spending for flash memory in 2017 ($19.0 billion) is still expected to be significantly higher than spending allocated to the DRAM/SRAM category ($13.0 billion). Overall, IC Insights believes that essentially all of the spending for flash memory in 2017 will be dedicated to 3D NAND process technology, including production of 3D NAND at Samsung’s giant new fab in Pyeongtaek, South Korea.

Overall, capital spending for the flash memory segment is forecast to register a 33% surge in 2017 after a strong 23% increase in 2016.  However, historical precedent in the memory market shows that too much spending usually leads to overcapacity and subsequent pricing weakness.  With Samsung, SK Hynix, Micron, Intel, Toshiba/Western Digital/SanDisk, and XMC/Yangtze River Storage Technology all planning to significantly ramp up 3D NAND flash capacity over the next couple of years (and new Chinese producers possibly entering the market), IC Insights believes that the future risk for overshooting 3D NAND flash market demand is high and growing.

Report Details:  The 2017 McClean Report

Liat

Recent Posts

IEEE Study Develops a Compact Metalens That Keeps Images Sharp Across Different Distances

Researchers develop a metasurface that combines an optical lens and focus-correcting functionalities into one flat…

2 days ago

Teradar Announces New German Headquarters to Accelerate Testing and Commercialization of its Pioneering Terahertz Vision and Sensing Products for Autonomous Vehicle Advancement in Europe

Teradar GmbH will strengthen European competitiveness in global self-driving vehicle markets with "Made in Europe"…

2 days ago

CANoe Automates Development and Testing Workflows with AI Agents

With new AI agents and the Model Context Protocol (MCP), CANoe executes complete workflows via…

2 days ago

IBM Connects Its First Modular Cryogenic Systems in Milestone Toward Fault-Tolerant Quantum Computing

• New cryogenic quantum fridges designed to link hundreds of quantum chips. • Cooled to…

2 days ago

Analog Devices Posts Record Q3 Revenue as Industrial and Data Center Demand Accelerates

Analog Devices (ADI) reported record revenue of $4.02 billion for its fiscal third quarter of…

2 days ago

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

1 week ago